Superior Family of Tin and Tin-Alloy Coatings for Electronics.
AnoTin coatings offer readily-solderable deposits of varying melting points and excellent as-deposited luster.
|Pure, bright tin deposit with aesthetic appearance suitable for exposed sheet metal parts.
|Pure, matte tin with best solderability and lowest carbon content.
|Brightened 60% tin / 40% lead with lowest melting point (360 F).
|AnoTin LM Matte 60% tin /40% lead.
|Readily solderable to a high degree.
|Brightened 93% tin / 7 % lead alloy that prevents tin whiskers and reduces lead content.
|Ano Tin IM
|Immersion tin deposit of 10 to 25 microinches thickness for coating copper, brass, and copper alloy parts.
These versatile tin and tin-alloy coatings exceed a wide range of industrial specifications as well as the following standard requirements:
|LB, LM , LL
Anoplate performs routine solderability tests to ensure compliance with governing specifications, including Method 208 of MIL-STD-202. Carbon content of the deposit is analyzed as-required to minimize the co-deposition of organic matter (carbon) in the coating.
Thickness and composition are closely-controlled using X-ray fluorescence technology measured directly on your parts [see photo below].
- Readily solderable
- Can be applied over various underplates to tailor the coating system to your application (nickel, electroless nickel, copper)
- Can be applied to nearly any substrate material
- Can be reflowed for enhanced aesthetics, solderability, and storage life
For questions about this process or if you would you like to discuss an application for AnoTin? Contact Us Today.