Superior tin and tin alloy coatings for the electronics industry
AnoTin coatings offer readily solderable deposits of varying melting points and as-deposited luster. These versatile tin and tin alloy coatings meet a wide range of industrial specifications as well as the following standard requirements:
| AnoTin Type |
Gov't |
ASTM |
AMS |
| AB, AM |
MIL-T-10727 |
B 545 |
2408 |
| LB, LM , LL |
MIL-P-81728 |
B 579 |
NA |
| IM |
MIL-T-81955 |
NA |
2409 |
Anoplate performs routine solderability tests to assure compliance with governing specifications, including Method 208 of MIL-STD-202. Carbon content of the deposit is analyzed as required to minimize co-deposition of organic matter in the coating.
| AnoTin Coating |
Coating Characteristics |
| AnoTin AB |
Pure, bright tin deposit with aesthetic appearance suitable for exposed sheet metal parts. |
| AnoTin AM |
Pure, matte tin with best solderability and lowest carbon content. |
| AnoTin LB |
Brightened 60% tin / 40% lead with lowest melting point (360 F). |
| AnoTin LM Matte 60% tin /40% lead. |
Readily solderable to a high degree. |
| AnoTin LL |
Brightened 93% tin / 7 % lead alloy that prevents tin whiskers and reduces lead content. |
| Ano Tin IM |
Immersion tin deposit of 10 to 25 microinches thickness for coating copper, brass, and copper alloy parts. |
 |
Rack or barrel
plating of electronic
components with
tin or tin/lead |
 |
All AnoTin coatings may be reflowed for enhanced appearance, solderability, and storage life. In general, however, AnoTin coatings are formulated so that reflowing is unnecessary.
They can be applied to nearly any substrate material. They are excellent options with various types of under- plates, including copper, electroless nickel, and nickel.
Depending on the specific application, Anoplate can engineer the most suitable combination of underplating and AnoTin overplate. |
